The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Nov. 17, 2017
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yu-Jia Huo, Beijing, CN;

Yu-Dan Zhao, Beijing, CN;

Xiao-Yang Xiao, Beijing, CN;

Ying-Cheng Wang, Beijing, CN;

Tian-Fu Zhang, Beijing, CN;

Yuan-Hao Jin, Beijing, CN;

Qun-Qing Li, Beijing, CN;

Shou-Shan Fan, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/786 (2006.01); H01L 29/51 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01); H01L 29/24 (2006.01); H01L 51/00 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78696 (2013.01); H01L 21/02164 (2013.01); H01L 21/02178 (2013.01); H01L 21/02266 (2013.01); H01L 29/1606 (2013.01); H01L 29/24 (2013.01); H01L 29/42356 (2013.01); H01L 29/42384 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/66045 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); H01L 29/78603 (2013.01); H01L 51/0048 (2013.01); H01L 51/0529 (2013.01); H01L 51/0558 (2013.01); H01L 21/0223 (2013.01); H01L 21/0228 (2013.01); H01L 21/02181 (2013.01); H01L 21/02192 (2013.01); H01L 21/02255 (2013.01); H01L 21/02568 (2013.01); H01L 51/0096 (2013.01); H01L 51/0097 (2013.01);
Abstract

The disclosure relates to a thin film transistor and a method for making the same. The thin film transistor includes a substrate; a gate on the substrate; a dielectric layer on the gate, wherein the dielectric layer includes a first sub-dielectric layer and a second sub-dielectric layer stacked on one another, and the first sub-dielectric layer is a first oxide dielectric layer formed by magnetron sputtering and in direct contact with the gate; a semiconductor layer on the dielectric layer, wherein the semiconductor layer includes nano-scaled semiconductor materials; and a source and a drain, wherein the source and the drain are on the dielectric layer, spaced apart from each other, and electrically connected to the semiconductor layer. The thin film transistor almost has no current hysteresis.


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