The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Dec. 28, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Marc A. Bergendahl, Rensselaer, NY (US);

James J. Demarest, Rensselaer, NY (US);

Christopher J. Penny, Saratoga Springs, NY (US);

Christopher Waskiewicz, Rexford, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 28/90 (2013.01); H01L 28/92 (2013.01);
Abstract

A backend-of-the-line (BEOL) semiconductor capacitor made by method, apparatus, or computer program product, through an airgap metallization process, patterning a first electrode by removing a portion of inter-layer dielectric for a desired capacitor area, depositing a dielectric for a capacitor insulator, filling the desired capacitor area to form a second electrode, polishing and capping the second electrode, and interconnecting the first electrode and the second electrode. The manufactured product has a bottom electrode, composed of a conductor, electrically connected to upward conductive prominences; a low-K layer, above and conjoined to the bottom layer and surrounding the prominences, composed of a low-K dielectric; an isolation layer, above the low-K layer and surrounding the prominences, composed of a high-K insulator material, where modulating its material and thickness controls the capacitance; and a top electrode, composed of a conductor and electrically connected to downward prominences, where the bottom and top electrodes are interconnected.


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