The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Feb. 20, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yeong A Kim, Suwon-si, KR;
Eun Sil Kim, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
Akihisa Kuroyanagi, Suwon-si, KR;
Jin Su Kim, Suwon-si, KR;
Jun Woo Myung, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package module includes a core member having first and second through-holes. A semiconductor chip is in the first through-hole and has an active surface with a connection pad and an inactive surface opposing the active surface. Another passive component is in the second through-hole. An first encapsulant covers at least portions of the core member and the passive component, and fills at least a portion of the second through-hole. A reinforcing member is on the first encapsulant. A second encapsulant covers at least a portion of the semiconductor chip, and fills at least a portion of the first through-hole. A connection member is on the core member, the active surface of the semiconductor chip, and the passive component, and includes a redistribution layer electrically connected to the connection pad and the passive component.