The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jan. 17, 2018
Berliner Glas Kgaa Herbert Kubatz Gmbh & Co., Berlin, DE;
Volker Schmidt, Berlin, DE;
Ralf Hammer, Freiberg, DE;
Gregor Hasper, Berlin, DE;
Mike Fischer, Berlin, DE;
Berliner Glas KGaA Herbert Kubatz GmbH & Co., Berlin, DE;
Abstract
A method for processing a holding plate () of a clamping device (in particular clamp wafer chuck) for holding a component, in particular a wafer, wherein the holding plate () has a SiC-based surface () on which at least one protruding, SiC-based surface element () is formed, includes the steps of locally limited heating of the holding plate () in a predetermined surface section and creating the surface element () at the predetermined surface section by chemical vapor deposition, in particular by means of laser CVD. Applications of the method exist in repairing a holding plate () of a clamping device or manufacturing a holding plate () of a clamping device. Furthermore, a holding plate of a clamping device for holding a component, in particular a wafer, is described.