The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Apr. 20, 2016
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Jun Tanaka, Kuwana Mie, JP;
Masaya Shima, Oita Oita, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); H01L 21/67092 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 24/14 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/6839 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/11 (2013.01); H01L 2224/94 (2013.01);
Abstract
An apparatus for manufacturing a semiconductor device includes a stage configured to hold tape adhering to a second surface of a semiconductor wafer having the second surface and a first surface opposite to the second surface, a vacuum mechanism attachable to an upper side of a substrate provided to adhere to the first surface, a driving unit configured to drive the vacuum mechanism in a direction by which the vacuum mechanism is separated from the substrate, and a cooling unit configured to cool the tape.