The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Nov. 22, 2017
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Andrew Cahill, Goleta, CA (US);
Jonathan Getty, Goleta, CA (US);
Daniel D. Lofgreen, Santa Maria, CA (US);
Paul A. Drake, Murrieta, CA (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/18 (2006.01); H01L 21/324 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/324 (2013.01); H01L 21/02282 (2013.01); H01L 21/185 (2013.01); H01L 21/187 (2013.01); H01L 21/56 (2013.01); H01L 21/67132 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01);
Abstract
In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure.