The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Feb. 23, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Toru Onoue, Tokyo, JP;

Daisuke Himeta, Tokyo, JP;

Hikaru Hirabayashi, Tokyo, JP;

Fumiaki Satoh, Tokyo, JP;

Yuma Hattori, Tokyo, JP;

Takuto Okamoto, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/35 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/35 (2013.01); H01G 4/30 (2013.01);
Abstract

A first external electrode is disposed on an end surface. A second external electrode is disposed on a side surface. The first external electrode includes a first sintered electrode layer, a second sintered electrode layer disposed on the first sintered electrode layer, and a plated layer disposed on the second sintered electrode layer. The second external electrode includes a third sintered electrode layer and a plated layer disposed on the third sintered electrode layer. The first, second, and third sintered electrode layers include a void. A void fraction of each of the first and third sintered electrode layers is larger than a void fraction of the second sintered electrode layer.


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