The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jul. 13, 2016
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Masuo Yatabe, Tokyo, JP;

Kozue Imaizumi, Tokyo, JP;

Noriyuki Mabuchi, Tokyo, JP;

Kazuhiko Oyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 27/2804 (2013.01); H05K 3/3431 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/0792 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/048 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract

One object is to compensate the reduction of the Q value due to reduction of core sectional area of a coil of an inductor, and the reduction of positional accuracy and adhesive strength of components mounted on a printed circuit board due to reduction of area of external electrodes, both caused by downsizing of component sizes. An inductor is provided which includes: a coil formed in an insulator and having one end and the other end thereof formed in a direction away from a mounting surface; and lead-out portions connected to the coil at positions more distant from the mounting surface than a portion of the coil closest to the mounting surface.


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