The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Dec. 30, 2016
Applicant:

Capital One Services, Llc., McLean, VA (US);

Inventors:

David Wurmfeld, Fairfax, VA (US);

Tyler Locke, Washington, DC (US);

Theodore Markson, Reston, VA (US);

Adam Koeppel, Washington, DC (US);

Assignee:

CAPITAL ONE SERVICES, LLC, McLean, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/02 (2006.01); G06Q 20/34 (2012.01); G06Q 20/40 (2012.01);
U.S. Cl.
CPC ...
G06K 19/07722 (2013.01); G06K 19/02 (2013.01); G06K 19/07707 (2013.01); G06K 19/07733 (2013.01); G06K 19/07773 (2013.01); G06Q 20/341 (2013.01); G06Q 20/352 (2013.01); G06Q 20/354 (2013.01); G06Q 20/3552 (2013.01); G06Q 20/405 (2013.01); G06Q 20/4016 (2013.01);
Abstract

A dynamic transaction card that includes a transaction card having a number of layers, each of which may be interconnected to one another. For example, a dynamic transaction card may include an outer protective layer, a core layer, a potting layer, a touch sensor layer, a display layer (including, for example, LEDs, a dot matrix display, and the like), a microcontroller storing firmware, Java applets, Java applet integration, and the like, an EMV™ chip, an energy storage component, one or more antennas (e.g., Bluetooth™ antenna, NFC antenna, and the like), a power management component, a flexible printed circuit board (PCB), a chassis, and/or a card backing layer, which may include a back protective layer. The antennas may be mounted on the protective layers, which may be laminated to the core layer, and connected to the core layer onto a printed circuit board (PCB) using conductive epoxies.


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