The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Sep. 04, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Emrah Acar, Montvale, NJ (US);

Moyra K. McManus, Veldhoven, NL;

Sani R. Nassif, Austin, TX (US);

Matthew J. Sullivan, Pflugerville, TX (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5036 (2013.01); G06F 17/5045 (2013.01);
Abstract

A system, method and computer program product for sorting Integrated Circuits (chips), particularly microprocessor chips, and particularly that predicts chip performance or power for sorting purposes. The system and method described herein uses a combination of performance-predicting parameters that are measured early in the process, and applies a unique method to project where the part, e.g., microprocessor IC, will eventually be sorted. Sorting includes classifying the IC product to a subset of a family of products with the product satisfying certain performance characteristics or specifications, in the early stages of manufacturing, e.g., before the end product is fully fabricated.


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Acar, Emrah. (2019). Power and performance sorting of microprocessors from first interconnect layer to wafer final test (U.S. Patent No. 10474774). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10474774

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