The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Apr. 03, 2018
Applicants:

Xyzprinting, Inc., New Taipei, TW;

Kinpo Electronics, Inc., New Taipei, TW;

Inventors:

Tsai-Yi Lin, New Taipei, TW;

Chien-Te Lee, New Taipei, TW;

Chen-Fu Huang, New Taipei, TW;

An-Hsiu Lee, New Taipei, TW;

Assignees:

XYZprinting, Inc., New Taipei, TW;

Kinpo Electronics, Inc., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2018.01); G05B 19/4099 (2006.01); B29C 64/129 (2017.01); B29C 64/393 (2017.01); B29C 64/124 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B29C 64/241 (2017.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); B29C 64/124 (2017.08); B29C 64/129 (2017.08); B29C 64/393 (2017.08); B29C 64/241 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); G05B 2219/49007 (2013.01); G05B 2219/49023 (2013.01);
Abstract

A 3D printing method adapted for a 3D printer is provided. The 3D printer includes a tank filled with a liquid-state forming material, a platform, a curing module and a control module. At least one of the tank and the platform as well as the curing module are electrically connected to the control module to be controlled by the same, and a 3D object is formed on the platform. The 3D printing method includes analyzing a model of the 3D object to obtain a layered information; the control module correspondingly distributes the layered information at a plurality of forming positions at the bottom of the tank. A forming layer is cured by the curing module and located at a forming position, and then the platform and the tank rotate relatively to move the forming layer to another forming position, and another forming layer is formed at the another forming position.


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