The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Oct. 20, 2017
Applicant:

Wuhan China Star Optoelectronics Technology Co., Ltd., Wuhan, Hubei, CN;

Inventors:

Lihua Zheng, Guangdong, CN;

Huanhuan Bu, Guangdong, CN;

Pan Yang, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); G06F 3/041 (2006.01); G02F 1/1362 (2006.01); H01L 29/786 (2006.01); G02F 1/1343 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 27/12 (2006.01); G06F 3/044 (2006.01); G02F 1/1368 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13338 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/133345 (2013.01); G02F 1/134309 (2013.01); G02F 1/136209 (2013.01); G02F 1/136227 (2013.01); G02F 1/136286 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/02675 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1248 (2013.01); H01L 27/1274 (2013.01); H01L 29/66757 (2013.01); H01L 29/78633 (2013.01); H01L 29/78675 (2013.01); G02F 1/133514 (2013.01); G02F 2001/13685 (2013.01); G02F 2001/134372 (2013.01); G02F 2001/136295 (2013.01); G02F 2202/104 (2013.01); G06F 2203/04103 (2013.01);
Abstract

The present disclosure discloses an array substrate and its manufacturing method and display panel, wherein, the method for fabricating the array substrate including the steps of: providing a substrate; sequentially forming a TFT functional layer, a touch signal transmission line, a first insulating layer, a first electrode, and a second insulating layer on the substrate; forming a first via and a second via on the second insulating layer by photolithography; forming a second electrode and a metal pattern on the second insulating layer; wherein the metal pattern connects the touch signal transmission line and the first electrode through the first via, and the second electrode connects the source and/or drain through the second via. By the above-described method, the present disclosure can reduce the manufacturing process of the array substrate, thereby reducing the manufacturing cost of the array substrate.


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