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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10472548 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Oct. 27, 2017

Diene/dienophile couples and thermosetting resin compositions having reworkability

Applicant:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventors:

Timothy M. Champagne, Orange, AZ (US);

Laxmisha M. Sridhar, Monmouth Junction, NJ (US);

Jonathan B. Israel, Carson, CA (US);

Philip T. Klemarczyk, Canton, CT (US);

XianMan Zhang, Cheshire, CT (US);

Benny E. Jordan, Corona, CA (US);

Assignee:

Henkel IP & Holding GmbH, Duesseldorf, DE;

Attorney:

Steven C. Bauman

Primary Examiner:

Margaret G Moore

Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); C08K 5/092 (2006.01); C08F 283/10 (2006.01); C07C 33/12 (2006.01); C07C 69/54 (2006.01); C07C 69/753 (2006.01); C07D 303/16 (2006.01); C07D 303/28 (2006.01); C09J 163/04 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08L 53/02 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C07C 33/12 (2013.01); C07C 69/54 (2013.01); C07C 69/753 (2013.01); C07D 303/16 (2013.01); C07D 303/28 (2013.01); C08F 283/10 (2013.01); C08G 59/226 (2013.01); C08G 59/24 (2013.01); C08G 59/4021 (2013.01); C08G 59/5073 (2013.01); C08G 59/56 (2013.01); C08K 5/092 (2013.01); C08L 53/02 (2013.01); C08L 63/00 (2013.01); C09J 163/04 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); H01L 23/3142 (2013.01); H01L 23/49838 (2013.01); C07C 2603/68 (2017.05); C08L 79/085 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

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