The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jun. 26, 2015
Applicant:

Mitsubishi Engineering-plastics Corporation, Tokyo, JP;

Inventors:

Masahide Sugiyama, Kanagawa, JP;

Ryusuke Yamada, Kanagawa, JP;

Tatsuya Kikuchi, Kanagawa, JP;

Yasushi Yamanaka, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 131/04 (2006.01); C23C 18/20 (2006.01); C08L 101/12 (2006.01); C09D 7/61 (2018.01); C09D 7/40 (2018.01); C09D 177/00 (2006.01); C23C 18/16 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
C09D 131/04 (2013.01); C08L 101/12 (2013.01); C09D 7/61 (2018.01); C09D 7/70 (2018.01); C09D 177/00 (2013.01); C23C 18/1667 (2013.01); C23C 18/20 (2013.01); H05K 3/105 (2013.01); H05K 3/182 (2013.01); H05K 3/0032 (2013.01);
Abstract

Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.


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