The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Feb. 26, 2016
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Yohei Ono, Nagoya, JP;

Yasushi Uchida, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01); B32B 37/14 (2006.01); C09D 7/61 (2018.01); C04B 41/85 (2006.01); C04B 38/00 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); C04B 28/24 (2006.01); F01N 3/28 (2006.01); C04B 111/10 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C09D 7/61 (2018.01); B32B 3/12 (2013.01); B32B 37/146 (2013.01); C04B 28/24 (2013.01); C04B 38/0016 (2013.01); C04B 38/0019 (2013.01); C04B 41/009 (2013.01); C04B 41/5089 (2013.01); C04B 41/85 (2013.01); B32B 2255/20 (2013.01); B32B 2305/024 (2013.01); C04B 2111/00793 (2013.01); C04B 2111/1062 (2013.01); F01N 3/2828 (2013.01); F01N 2330/06 (2013.01);
Abstract

The circumference coating material fills a recessed groove that is formed on a circumferential surface of a honeycomb fired body and extends an axial direction at which a part of cells are opened to the outside and to cover the circumferential surface, thereby forming a circumferential wall on the circumferential surface of a honeycomb structure, and the circumference coating material includes colloidal silica in a part of raw materials to be used and has a chlorine concentration of 150 ppm or less. In addition, the colloidal silica to be used has a chlorine concentration of 500 ppm or less, and the colloidal silica is produced using at least any one acid of sulfuric acid, phosphoric acid, and organic acid.


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