The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Mar. 14, 2018
Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya-shi, Aichi-ken, JP;

Inventors:

Hideki Hayashi, Nagoya, JP;

Taisuke Mizuno, Yokkaichi, JP;

Keita Hirai, Nagoya, JP;

Yuichi Ito, Mie-ken, JP;

Assignee:

BROTHER KOGYO KABUSHIKI KAISHA, Nagoya-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/045 (2006.01); B41J 2/185 (2006.01); H01L 41/187 (2006.01); H01L 41/04 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/04541 (2013.01); B41J 2/04548 (2013.01); B41J 2/04581 (2013.01); B41J 2/1433 (2013.01); B41J 2/14233 (2013.01); B41J 2/1607 (2013.01); B41J 2/1623 (2013.01); B41J 2/185 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/03 (2013.01); B41J 2202/12 (2013.01); B41J 2202/13 (2013.01); H01L 41/042 (2013.01); H01L 41/0475 (2013.01); H01L 41/0533 (2013.01); H01L 41/0973 (2013.01); H01L 41/1876 (2013.01);
Abstract

There is provided a liquid discharge apparatus which includes a channel substrate having a nozzle, a pressure chamber which communicates with the nozzle, an actuator which covers the pressure chamber, and a contact point that is electrically connected to the actuator, and a circuit board which has wires that are to be electrically connected to contact points, and which is adhered to the channel substrate. The channel substrate includes an adhesive wall which is provided with contact points, and which has a surface to which an adhering portion of the circuit board to be adhered to the channel substrate, is adhered, and further includes a wall portion which is provided with a cavity on a side of the adhesive wall, opposite to the surface, and which demarcates the cavity on a side opposite to the surface, of the adhesive wall, and the adhering portion is facing the cavity and the wall portion.


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