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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10471681 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Jul. 16, 2013

Heat de-bondable adhesive articles

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Scott M. Tapio, Falcon Heights, MN (US);

Audrey A. Sherman, Woodbury, MN (US);

Kevin R. Schaffer, Woodbury, MN (US);

Joseph D. Rule, Cottage Grove, MN (US);

Lan H. Liu, Rosemount, MN (US);

Margot A. Branigan, Roseville, MN (US);

Ross E. Behling, St. Paul, MN (US);

Assignee:

3M Innovative Properties Company, St. Paul, MN (US);

Attorney:

Jeffrey M. Olofson

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 7/028 (2019.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 7/028 (2019.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 37/12 (2013.01); B32B 37/14 (2013.01); B32B 37/18 (2013.01); B32B 37/182 (2013.01); B32B 38/00 (2013.01); B32B 38/0036 (2013.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/40 (2013.01); B32B 2307/412 (2013.01); B32B 2307/70 (2013.01); B32B 2307/736 (2013.01); B32B 2405/00 (2013.01); B32B 2551/00 (2013.01); C09J 2201/128 (2013.01); C09J 2201/606 (2013.01); C09J 2201/622 (2013.01); C09J 2203/318 (2013.01); C09J 2400/226 (2013.01); Y10T 156/10 (2015.01); Y10T 428/266 (2015.01); Y10T 428/2848 (2015.01);
Abstract

Heat de-bondable adhesive articles include a heat-shrinkable optical substrate with optically clear adhesive disposed on the two major surfaces of the heat-shrinkable substrate. Optical articles can be prepared by disposing the heat de-bondable adhesive articles between two optical substrates. Other optical articles can be prepared by disposing an optically clear adhesive layer and a heat-shrinkable optical substrate on an optical substrate.

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