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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10471660 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Aug. 17, 2015

Manufacturing method of bonding structure and bonding structure

Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Kazuyoshi Nishikawa, Ritto, JP;

Akio Sumiya, Kusatsu, JP;

Satoshi Hirono, Kusatsu, JP;

Tomoyuki Hakata, Uji, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:

JCIPRNET

Primary Examiner:

Daniel H Lee

Int. Cl.
CPC ...
B29C 65/16 (2006.01); B23K 26/324 (2014.01); B23K 26/21 (2014.01); B23K 26/57 (2014.01); B29C 65/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/16 (2013.01); B23K 26/21 (2015.10); B23K 26/324 (2013.01); B23K 26/57 (2015.10); B29C 65/1616 (2013.01); B29C 65/1635 (2013.01); B29C 65/1661 (2013.01); B29C 66/0246 (2013.01); B29C 66/1122 (2013.01); B29C 66/30325 (2013.01); B29C 66/43 (2013.01); B29C 66/8322 (2013.01); B29C 65/1683 (2013.01); B29C 66/71 (2013.01); B29C 66/721 (2013.01); B29C 66/7212 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73921 (2013.01); B29C 66/73941 (2013.01); B29C 66/742 (2013.01); B29C 66/7422 (2013.01); B29C 66/74281 (2013.01); B29C 66/74283 (2013.01); B29C 66/919 (2013.01); B29C 66/939 (2013.01); B29K 2105/0079 (2013.01);
Abstract

A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.

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