The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jan. 13, 2015
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

David A. Raulerson, Palm Beach Garden, FL (US);

Kevin D. Smith, Glastonbury, CT (US);

Zhong Ouyang, Glastonbury, CT (US);

Lisa J. Brasche, Ellington, CT (US);

William J. Brindley, Hebron, CT (US);

David N. Potter, East Hampton, CT (US);

Assignee:

UNITED TECHNOLOGIES CORPORATION, Farmington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 6/00 (2006.01); F01D 9/02 (2006.01); F01D 25/12 (2006.01);
U.S. Cl.
CPC ...
B23P 6/002 (2013.01); F01D 9/02 (2013.01); F01D 25/12 (2013.01); B23P 2700/06 (2013.01); F05D 2220/32 (2013.01); F05D 2230/13 (2013.01); F05D 2230/80 (2013.01); F05D 2260/81 (2013.01); F05D 2300/611 (2013.01);
Abstract

Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.


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