The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Jul. 12, 2016
Applicants:

Medtronic, Inc., Minneapolis, MN (US);

Kyocera Corporation, Kyoto, JP;

Inventors:

Kengo Morioka, San Diego, CA (US);

Keiichi Fujii, San Jose, CA (US);

Arne Knudsen, San Diego, CA (US);

Shingo Satou, Kirishima, JP;

Hidekazu Otomaru, Kiyomizu, JP;

Hiroshi Makino, Kirishima, JP;

Andrew Thom, Maple Grove, MN (US);

Markus Reiterer, Plymouth, MN (US);

Gordon Munns, Stacy, MN (US);

Thomas Miltich, Otsego, MN (US);

Joyce Yamamoto, Maple Grove, MN (US);

Assignees:

MEDTRONIC, INC., Minneapolis, MN (US);

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); H01B 17/30 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); H01B 17/30 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/112 (2013.01); H05K 3/0044 (2013.01); H05K 3/4046 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.


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