The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Mar. 14, 2018
Applicant:

Cpt Zwei Gmbh, Hannover, DE;

Inventors:

Frieder Wittmann, Heilsbronn, DE;

Karin Beart, Lauf an der Pegnitz, DE;

Johannes Bock, Erlangen, DE;

Thomas Schmidt, Burglengenfeld, DE;

Bernhard Schuch, Neusitz, DE;

Assignee:

CPT ZWEI GMBH, Hannover, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 5/06 (2006.01); H05K 1/14 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); H05K 9/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); H05K 1/142 (2013.01); H05K 1/181 (2013.01); H05K 5/0017 (2013.01); H05K 5/0082 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); H01L 21/56 (2013.01); H05K 1/189 (2013.01); H05K 9/0024 (2013.01); H05K 9/0052 (2013.01); H05K 9/0071 (2013.01); H05K 9/0081 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10522 (2013.01);
Abstract

The disclosure relates to a control device in a motor vehicle. The control device includes a housing cover with a peripheral edge region, and a planar, electrical connecting apparatus with integrated conductor tracks. The housing cover, in the edge region, is cohesively connected at least to the connecting apparatus and forms a cavity with the connecting apparatus. The control device also includes at least one electronic component within the cavity. The connecting apparatus electrically connects the at least one electronic component to electronic components outside the cavity. The peripheral edge region is encapsulated by injection molding in a media-tight manner by a polymer at least in the region of the connecting seam between the housing cover and the connecting apparatus.


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