The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Aug. 06, 2018
Lockheed Martin Corporation, Bethesda, MD (US);
Randall Mark Stoltenberg, Palo Alto, CA (US);
Nathan Khosla, La Jolla, CA (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
The present disclosure describes methods of soldering on printed circuits, and, more specifically, to methods of using a copper-containing layer or copper 'ink' in low-temperature soldering using established solder processes on silver-containing layers in circuit boards. The present disclosure is also directed, in part, to a solder joint having a copper-containing layer acting as a bonding layer between a traditional solder and a silver-containing layer 'ink' on a printed circuit board. The low-temperature forming of the solder joint occurs at or below a temperature of 300° C. and occurs via at least one of sintering, photosintering, lasersintering, local resistive heating, or electrochemical deposition. The methods disclosed can satisfy the growing demand for creating reliable interconnection joints that can be used in next generation electronics and printed electrical circuit boards.