The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Nov. 09, 2018
Applicants:

Hong Fu Jin Precision Industry (Wuhan) Co., Ltd., Wuhan, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Hou-Yuan Chou, New Taipei, TW;

Ming-Fang Chen, Wuhan, CN;

Yi-Chih Wu, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 7/00 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A circuit board assembly comprising a printed circuit main board and a printed circuit sub-board, to avoid layout constraints, can support components on either board. The printed circuit main board includes first signal layer, and first and second through holes in the first signal layer. A first wire electrically couples a first electronic component and the first through hole. A second signal layer with third and fourth through holes is found on the printed circuit sub-board. The third through hole is electrically coupled to the first through hole, and the fourth through hole is electrically coupled to the second through hole.


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