The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Oct. 03, 2016
Applicant:

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Inventors:

Aya Takasaki, Shiga, JP;

Yoshihito Yamaguchi, Shiga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0253 (2013.01); H05K 3/28 (2013.01); H05K 3/4611 (2013.01); H05K 3/4676 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/2009 (2013.01);
Abstract

A printed circuit board according to an embodiment of the present invention, which is configured to be disposed on an inner surface of an airtight case having an opening so as to hermetically cover the opening, includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening. An electronic component according to another embodiment of the present invention includes an airtight case having an opening and a printed circuit board disposed on an inner surface of the airtight case so as to hermetically cover the opening, wherein the printed circuit board includes a shielding layer containing a liquid crystal polymer as a main component at least in a region covering the opening.


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