The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Mar. 17, 2017
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventors:

Isaac Ko, Kwun Tong, HK;

Ka Wai Ho, Diamond Hill, HK;

Wan Tim Chan, Yuen Long, HK;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/26 (2006.01); A61B 8/00 (2006.01); H03B 5/32 (2006.01); H03F 1/32 (2006.01); H03F 3/30 (2006.01);
U.S. Cl.
CPC ...
H03F 3/265 (2013.01); A61B 8/4272 (2013.01); A61B 8/4483 (2013.01); H03B 5/32 (2013.01); H03F 1/3205 (2013.01); H03F 3/3023 (2013.01); H03F 2200/261 (2013.01); H03F 2200/372 (2013.01); H03F 2200/498 (2013.01); H03F 2200/75 (2013.01);
Abstract

An ultrasound probe buffer is provided. The ultrasound probe buffer may include a high impedance amplifier having a common-source core stage with series-series local feedback. The high impedance amplifier may include a first MOSFET and a second MOSFET, wherein a source terminal of the first MOSFET is coupled to a source terminal of the second MOSFET.


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