The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Jun. 27, 2018
Applicant:

Lotes Co., Ltd, Keelung, TW;

Inventors:

Ted Ju, Keelung, TW;

Chin Chi Lin, Keelung, TW;

Assignee:

LOTES CO., LTD, Keelung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 24/78 (2011.01); H01R 43/02 (2006.01); H01R 13/66 (2006.01); H05K 7/20 (2006.01); H01R 13/516 (2006.01);
U.S. Cl.
CPC ...
H01R 24/78 (2013.01); H01R 13/516 (2013.01); H01R 13/6658 (2013.01); H01R 43/0256 (2013.01); H05K 7/2039 (2013.01); H05K 7/20154 (2013.01); H05K 7/20918 (2013.01);
Abstract

An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.


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