The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Apr. 27, 2017
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Michiharu Yokoyama, Kyoto, JP;

Nobumitsu Amachi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01Q 1/52 (2006.01); H01Q 21/22 (2006.01); H01Q 21/06 (2006.01); H01Q 25/00 (2006.01); H01L 21/56 (2006.01); H01Q 19/30 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/24 (2013.01); H01Q 1/526 (2013.01); H01Q 21/065 (2013.01); H01Q 21/067 (2013.01); H01Q 21/22 (2013.01); H01Q 23/00 (2013.01); H01Q 25/00 (2013.01); H01L 21/561 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01Q 19/30 (2013.01);
Abstract

An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.


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