The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Apr. 19, 2016
Applicants:

Osram Gmbh, München, DE;

Alanod Gmbh & Co. KG, Ennepetal, DE;

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Jörg Erich Sorg, Regensburg, DE;

Stefan Ziegler, Sprockhövel, DE;

Michael Austgen, Essen, DE;

Alexander Peetsch, Gevelsberg, DE;

Eckhard Ditzel, Linsengericht, DE;

Michael Benedikt, Neuberg, DE;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); B32B 15/04 (2006.01); H01L 23/00 (2006.01); H01L 31/02 (2006.01); B32B 15/08 (2006.01); H05K 1/05 (2006.01); H05K 3/10 (2006.01); B32B 15/00 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); H01L 25/16 (2006.01); H01L 33/54 (2010.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B32B 7/12 (2013.01); B32B 15/00 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); B32B 37/12 (2013.01); H01L 24/48 (2013.01); H01L 25/167 (2013.01); H01L 31/02005 (2013.01); H01L 33/54 (2013.01); H05K 1/056 (2013.01); H05K 3/103 (2013.01); B32B 2307/20 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/40 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/1532 (2013.01); H01L 2933/0066 (2013.01); H05K 3/0097 (2013.01); H05K 3/386 (2013.01); H05K 2201/0358 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/055 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1545 (2013.01);
Abstract

A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.


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