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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10468558 B1

PDFFull Text
Date of Patent:
Nov. 05, 2019

Filed:

Dec. 30, 2015

Semiconductor light emitting device and method for manufacturing same

Applicant:

Semicon Light Co., Ltd., Gyeonggi-do, KR;

Inventors:

Seung Ho Baek, Gyeonggi-do, KR;

Soo Kun Jeon, Gyeonggi-do, KR;

Assignee:

SEMICON LIGHT CO., LTD., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 21/568 (2013.01); H01L 23/552 (2013.01); H01L 33/0079 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/46 (2013.01); H01L 33/505 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/19 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present disclosure relates to a semiconductor light emitting device and a method for manufacturing the same, in which the semiconductor light emitting device includes a semiconductor light emitting chip having a semiconductor light emitting part for generating light by electron-hole recombination, and at least one electrode electrically connected to the semiconductor light emitting part; a wall placed on a lateral side of the semiconductor light emitting part, with the wall having an elevated upper end caused by surface tension effects; and an encapsulant arranged in a bowl that is defined by the upper end of the wall and the semiconductor light emitting part, with the encapsulant for transmitting therethrough a light from the semiconductor light emitting part.

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