The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Nov. 28, 2017
Applicant:
Elwha Llc, Bellevue, WA (US);
Inventors:
Gleb M. Akselrod, Bellevue, WA (US);
Erik E. Josberger, Seattle, WA (US);
Mark C. Weidman, Bellevue, WA (US);
Assignee:
Elwha LLC, Bellevue, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01); G02B 5/18 (2006.01); G03H 1/04 (2006.01); H04N 5/225 (2006.01); H04N 5/374 (2011.01); G01S 7/481 (2006.01); H01Q 1/38 (2006.01); H01Q 3/44 (2006.01); H01Q 15/00 (2006.01); H01Q 15/02 (2006.01); H01Q 15/14 (2006.01); G01S 17/10 (2006.01); G01S 17/42 (2006.01); G01S 17/89 (2006.01); G02F 1/01 (2006.01); G02F 1/1339 (2006.01); G02F 1/1341 (2006.01); H01J 37/317 (2006.01); H01J 37/32 (2006.01); B29D 11/00 (2006.01); G03H 1/02 (2006.01); G02F 1/29 (2006.01); B82Y 20/00 (2011.01); G02F 1/1334 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); B29D 11/00326 (2013.01); G01S 7/4813 (2013.01); G01S 7/4817 (2013.01); G01S 17/10 (2013.01); G01S 17/42 (2013.01); G01S 17/89 (2013.01); G02B 5/1809 (2013.01); G02F 1/0107 (2013.01); G02F 1/1339 (2013.01); G02F 1/1341 (2013.01); G03H 1/0244 (2013.01); G03H 1/0443 (2013.01); H01J 37/3174 (2013.01); H01J 37/32816 (2013.01); H01L 27/14643 (2013.01); H01Q 1/38 (2013.01); H01Q 3/44 (2013.01); H01Q 15/002 (2013.01); H01Q 15/0066 (2013.01); H01Q 15/02 (2013.01); H01Q 15/148 (2013.01); H04N 5/2253 (2013.01); H04N 5/374 (2013.01); B82Y 20/00 (2013.01); G02F 1/13342 (2013.01); G02F 1/292 (2013.01); G02F 2202/103 (2013.01); G02F 2202/30 (2013.01); G02F 2202/36 (2013.01); G03F 7/2041 (2013.01); G03F 7/2059 (2013.01); G03H 2240/13 (2013.01); H01J 2237/334 (2013.01);
Abstract
A 2D hologram system with a matrix addressing scheme is provided. The system may include a 2D array of sub-wavelength hologram elements integrated with a refractive index tunable core material on a wafer substrate. The system may also include a matrix addressing scheme coupled to the 2D array of sub-wavelength hologram elements and configured to independently control each of the sub-wavelength hologram elements by applying a voltage.