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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10468400 B1

PDFFull Text
Date of Patent:
Nov. 05, 2019

Filed:

Jan. 12, 2018

Method of manufacturing substrate structure

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Pil Kyu Kang, Hwaseong-si, KR;

Seok Ho Kim, Hwaseong-si, KR;

Tae Yeong Kim, Yongin-si, KR;

Kwang Jin Moon, Hwaseong-si, KR;

Ho Jin Lee, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Edward Chin

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 21/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/187 (2013.01); H01L 21/76898 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 24/80 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8012 (2013.01); H01L 2224/80047 (2013.01); H01L 2224/80048 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the second device region, and bonding the first substrate and the second substrate, such that the first and second device regions are facing each other and are electrically connected to each other.

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