The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
May. 26, 2016
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Joseph S. Steffler, Waterloo, CA;
Sukhminder S. Binapal, Campbellville, CA;
Mark Vandermeulen, Burlington, CA;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
Implementations of semiconductor packages may include: a first semiconductor die having a plurality of balls coupled to a first side thereof, a second semiconductor die, a lead frame having a die attach area on a first side of the lead frame, the die attach area containing an opening therethrough and one or more wire bonds. The first semiconductor die may be coupled to a backside of the second semiconductor die by an adhesive on a second side of the first semiconductor die opposing the first side. The second semiconductor die may be mechanically and electrically coupled to the lead frame through one or more wire bonds at the die attach area. The first semiconductor die may be positioned within the opening in the center of the lead frame.