The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Dec. 10, 2014
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jun-Hyeok Yang, Seongnam-si, KR;
Se-Ki Kim, Suwon-si, KR;
Se-Ra An, Suwon-si, KR;
Hyung-Jong Ko, Seongnam-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A semiconductor chip includes a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate. The circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction. The thermoelectric layer includes a first on-die thermoelectric element, where the thermoelectric layer is disposed on the circuit layer including the first circuit and the second circuit. The first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit.