The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Jun. 09, 2014
Applicant:

Purdue Research Foundation, West Lafayette, IN (US);

Inventors:

Thomas Siegmund, West Lafayette, IN (US);

Yuezhong Feng, Henan, CN;

Somesh Khandelwal, Sunnyvale, CA (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); F28F 13/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); F28F 2013/001 (2013.01); F28F 2013/008 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Metamaterial systems capable of exhibiting changes in thermal conductivities in response to an external control or input, as well as methods relating thereto. The metamaterial systems include first and second plates, and a metamaterial core between and thermally coupled to the first and second plates. The metamaterial core comprises a plurality of elements coupled to and contacting each other, with each of the elements being a pseudo-tetrahedron having surfaces that define surface-to-surface contacts with at least one other of the elements. A force is applied to the metamaterial core that increases contact pressures between the elements at the surface-to-surface contacts thereof and thereby increases thermal contact conductivities at the surface-to-surface contacts and increases a thermal conductivity of the metamaterial core.


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