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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10468322 B1

PDFFull Text
Date of Patent:
Nov. 05, 2019

Filed:

Feb. 23, 2017

Semiconductor device capable of suppressing cracks of through-hole protective film and short circuit of adjacent through-electrodes

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Kazuyuki Kakuta, Kariya, JP;

Hisanori Yokura, Kariya, JP;

Minoru Murata, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Andrew Q Tran

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 29/84 (2006.01); G01L 9/00 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/266 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/324 (2006.01); H01L 21/56 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/60 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3192 (2013.01); G01L 9/0042 (2013.01); G01L 9/0054 (2013.01); H01L 21/0217 (2013.01); H01L 21/0273 (2013.01); H01L 21/02126 (2013.01); H01L 21/02271 (2013.01); H01L 21/266 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/324 (2013.01); H01L 21/3205 (2013.01); H01L 21/565 (2013.01); H01L 21/768 (2013.01); H01L 21/76802 (2013.01); H01L 21/76898 (2013.01); H01L 23/3171 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/60 (2013.01); H01L 29/84 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A semiconductor device includes: a first substrate having connectors at a first surface; a second substrate bonded with the first substrate having through-holes in a stacking direction of the first and second substrates for respectively exposing the connectors; through-electrodes respectively arranged at through-holes and electrically connected with the connectors; and a protective film for integrally covering the through-electrodes. Frame-shaped slits are formed to respectively surround the through-holes when viewed in a normal direction with respect to the first surface of the first substrate. The protective film is separated by the slit into a region inside the slit and a region outside the slit.

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