The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Apr. 20, 2017
Applicant:
Carsem (M) Sdn. Bhd., Ipoh, MY;
Inventors:
Yan Shan Ng, Ipoh, MY;
Lily Khor, Ipoh, MY;
Assignee:
CARSEM (M) SDN. BHD., Ipoh, MY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); G06K 9/00 (2006.01); G06K 9/20 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); G06K 9/0004 (2013.01); G06K 9/2018 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01);
Abstract
An electronic package is formed by placing a semiconductor die within an opening in a leadframe and performing a first molding operation. The die is wirebonded to the leadframe and a final encapsulation is performed with a second molding operation.