The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Jul. 27, 2018
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Thomas Schwarz, Regensburg, DE;

Stefan Groetsch, Bad Abbach, DE;

Joerg Erich Sorg, Regensburg, DE;

Christoph Koller, Nittendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 29/866 (2006.01); H01L 31/02 (2006.01); H01L 31/024 (2014.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 23/60 (2013.01); H01L 29/866 (2013.01); H01L 31/02002 (2013.01); H01L 31/024 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H05K 1/021 (2013.01); H05K 1/053 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/167 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/15313 (2013.01); H01L 2933/0075 (2013.01);
Abstract

Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.


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