The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Oct. 23, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Shoichi Kuga, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/08 (2006.01); H01L 21/48 (2006.01); H01L 23/057 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H02M 7/00 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/08 (2013.01); H01L 21/481 (2013.01); H01L 23/057 (2013.01); H01L 23/13 (2013.01); H01L 23/24 (2013.01); H01L 23/3135 (2013.01); H01L 23/49827 (2013.01); H01L 24/48 (2013.01); H02M 7/003 (2013.01); H01L 2224/48137 (2013.01); H02P 27/08 (2013.01);
Abstract
A semiconductor power module includes: an insulating substrate including a concave portion provided on a top surface of the insulating substrate; a substrate electrode embedded in the concave portion; a semiconductor device bonded onto the substrate electrode; and an insulating resin covering a top end part of the substrate electrode.