The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Feb. 06, 2018
Applicant:

Euclid Techlabs, Llc, Solon, OH (US);

Inventor:

James E Butler, Huntingtown, MD (US);

Assignee:

Euclid Techlabs, LLC, Solon, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/32 (2006.01); C30B 29/04 (2006.01); H01J 37/32 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02527 (2013.01); H01J 37/32192 (2013.01); H01J 37/32201 (2013.01); H01J 37/32449 (2013.01); H01J 37/32467 (2013.01); H01J 37/32724 (2013.01); H01L 21/02019 (2013.01); H01L 21/02024 (2013.01); H01L 21/0262 (2013.01); H01L 21/02376 (2013.01); H01L 21/02579 (2013.01); H01L 21/02584 (2013.01); H01L 21/02656 (2013.01); H01L 21/02658 (2013.01); H01J 2237/3321 (2013.01); H01L 21/02634 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

A method of preparing a diamond crystal substrate for epitaxial deposition thereupon of a delta doping layer includes preparing an atomically smooth, undamaged diamond crystal substrate surface, which can be in the (100) plane, by polishing the surface and then etching the surface to remove subsurface damage caused by the polishing. The polishing can include a rough polish, for example in the (010) direction, followed by a fine polish, for example in the (011) direction, that removes the polishing tracks from the rough polishing. After etching the polished face can have a roughness Sa of less than 0.3 nm. An inductively coupled reactive ion etcher can apply the etching at a homogeneous etch rate using an appropriate gas mixture such as using argon and chlorine to remove between 0.1 and 10 microns of material from the polished surface.


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