The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Jun. 11, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Makoto Osamura, Nagaokakyo, JP;
Yoshihito Otsubo, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/00 (2006.01); G06K 19/077 (2006.01); G06K 19/02 (2006.01); H01Q 9/16 (2006.01); H04B 1/40 (2015.01); G06K 19/07 (2006.01); H01Q 9/28 (2006.01); H04B 5/00 (2006.01); H01Q 1/22 (2006.01); H01Q 9/24 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07722 (2013.01); G06K 19/02 (2013.01); G06K 19/0723 (2013.01); G06K 19/0775 (2013.01); G06K 19/07749 (2013.01); G06K 19/07754 (2013.01); G06K 19/07783 (2013.01); H01Q 9/16 (2013.01); H01Q 9/285 (2013.01); H04B 1/40 (2013.01); H04B 5/0025 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/24 (2013.01); H05K 1/185 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/10098 (2013.01);
Abstract
An RFID module includes a laminated body including thermoplastic resin layers, a passive element defined by a conductor pattern on the thermoplastic resin layers, and an RFID IC chip embedded in the laminated body. The RFID IC chip and the conductor pattern are connected to each other by joining an input and output terminal of the RFID IC chip and a pad electrode, and an insulator pattern overlapping the pad electrode is provided around the RFID IC chip in the laminated body in planar view.