The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Apr. 30, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Ju Ho Kim, Suwon-Si, KR;

Eun Sil Kim, Suwon-Si, KR;

Sang Kyu Lee, Suwon-Si, KR;

Jong Man Kim, Suwon-Si, KR;

Seok Hwan Kim, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); G06K 9/00 (2006.01); G01D 5/24 (2006.01); G06F 9/22 (2006.01); G01N 27/22 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G01D 5/24 (2013.01); G01N 27/22 (2013.01); G01R 27/2605 (2013.01); G06F 9/223 (2013.01); G06K 9/00053 (2013.01); H01L 2224/18 (2013.01);
Abstract

A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.


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