The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Jun. 10, 2015
The Boeing Company, Chicago, IL (US);
Omid B. Nakhjavani, Kirkland, WA (US);
Mohammad Ali Heidari, Bellevue, WA (US);
Milan Stefanovic, Everett, WA (US);
Bradley A. Olmstead, Enumclaw, WA (US);
Eric John Zimney, North Charleston, SC (US);
Naveena Mallikarjunaiah, Everett, WA (US);
THE BOEING COMPANY, Chicago, IL (US);
Abstract
Example systems and methods to optimize and integrate of thermal and structural analyses are described herein. An example method includes performing a thermal analysis of a component using a first mesh representing the component to produce a thermal distribution across the component. The first mesh has first nodes based on a first element size. The example method includes using a first mapping file to assign temperature values to second nodes of a second mesh representing the component based on the thermal distribution. The second nodes are based on a second element size different than the first element size. The example method also includes performing a structural analysis of the component using the second mesh and the assigned temperature values to produce gauge sizes for the component and using a second mapping file to assign gauge values to the first nodes of the first mesh based on the gauge sizes.