The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Dec. 29, 2016
Applicants:
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, CN;
Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;
Inventors:
Assignees:
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;
Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 29/503 (2015.01); F21V 29/70 (2015.01); F21V 5/04 (2006.01); F21V 23/00 (2015.01); G02B 6/42 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); F21V 15/01 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
F21V 29/503 (2015.01); F21V 5/04 (2013.01); F21V 23/005 (2013.01); F21V 29/70 (2015.01); G02B 6/4281 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); F21V 15/01 (2013.01); G02B 6/4272 (2013.01); H05K 1/0203 (2013.01); H05K 1/0274 (2013.01); H05K 3/0061 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10121 (2013.01);
Abstract
An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.