The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Aug. 11, 2017
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Peter Mardilovich, Cambridge, GB;

Anthony M. Fuller, Corvallis, OR (US);

Qingqiao Wei, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/00 (2006.01); C25D 11/04 (2006.01); C25D 11/12 (2006.01); C25D 11/24 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
C25D 1/006 (2013.01); C23C 28/00 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 28/3455 (2013.01); C25D 11/045 (2013.01); C25D 11/12 (2013.01); C25D 11/24 (2013.01);
Abstract

A method of adhering a cover layer to a substrate includes forming an array of nano-structures on a substrate. A flowable material is applied to the substrate, the flowable material substantially enveloping the nano-structures on the substrate. The flowable material is solidified to form a cover layer on the substrate, the cover layer being anchored to the substrate via the nano-structures.


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