The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Oct. 20, 2015
Applicant:

Kao Corporation, Tokyo, JP;

Inventors:

Yoshiro Oda, Wakayama, JP;

Tomoya Tsuboi, Sakai, JP;

Yoshinori Hasegawa, Wakayama, JP;

Assignee:

KAO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/435 (2006.01); C08K 3/34 (2006.01); C08K 3/40 (2006.01); C08K 5/10 (2006.01); C08K 7/02 (2006.01); B29C 45/00 (2006.01); C08K 7/00 (2006.01); C08K 5/101 (2006.01); C08L 77/02 (2006.01); C08L 77/06 (2006.01); C08K 3/30 (2006.01); C08K 5/00 (2006.01); C08K 5/105 (2006.01); C08K 5/134 (2006.01); C08K 3/013 (2018.01); C08K 7/14 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); B29K 77/00 (2006.01); B29K 105/00 (2006.01); B29K 509/02 (2006.01); B29K 509/08 (2006.01);
U.S. Cl.
CPC ...
C08K 5/435 (2013.01); B29C 45/0001 (2013.01); C08K 3/30 (2013.01); C08K 3/34 (2013.01); C08K 3/346 (2013.01); C08K 5/0083 (2013.01); C08K 5/101 (2013.01); C08K 5/105 (2013.01); C08K 5/1345 (2013.01); C08K 7/00 (2013.01); C08K 7/02 (2013.01); C08L 77/02 (2013.01); C08L 77/06 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0038 (2013.01); B29K 2509/02 (2013.01); B29K 2509/08 (2013.01); B29K 2995/0082 (2013.01); B29K 2995/0091 (2013.01); C08K 3/013 (2018.01); C08K 5/0016 (2013.01); C08K 7/14 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/265 (2013.01); C08K 2003/3045 (2013.01); C08K 2201/016 (2013.01);
Abstract

A polyamide resin composition for a vibration-damping material, containing a polyamide resin, a plasticizer in an amount of from 7 to 35 parts by mass, and one or more members selected from the group consisting of plate-like fillers and acicular fillers in an amount of from 15 to 80 parts by mass, based on 100 parts by mass of the polyamide resin. The polyamide resin composition of the present invention can be suitably used as a vibration-damping material for a material for audio equipment such as, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.


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