The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Jan. 26, 2018
Applicant:
Vesuvius Usa Corporation, Champaign, IL (US);
Inventors:
James W. Stendera, Pittsburgh, PA (US);
Ryan Hershey, Pittsburgh, PA (US);
Assignee:
VESUVIUS USA CORPORATION, Champaign, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/10 (2006.01); C04B 33/13 (2006.01); C10M 113/10 (2006.01); C10M 169/04 (2006.01); C04B 33/04 (2006.01); C04B 35/14 (2006.01); C04B 35/565 (2006.01); C04B 35/63 (2006.01); C04B 35/632 (2006.01); C04B 35/634 (2006.01); C04B 35/66 (2006.01);
U.S. Cl.
CPC ...
C04B 33/1305 (2013.01); C04B 33/04 (2013.01); C04B 35/10 (2013.01); C04B 35/14 (2013.01); C04B 35/565 (2013.01); C04B 35/632 (2013.01); C04B 35/6303 (2013.01); C04B 35/634 (2013.01); C04B 35/63444 (2013.01); C04B 35/63488 (2013.01); C04B 35/63496 (2013.01); C04B 35/66 (2013.01); C10M 113/10 (2013.01); C10M 169/04 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/349 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/3852 (2013.01); C04B 2235/3873 (2013.01); C04B 2235/422 (2013.01); C04B 2235/424 (2013.01); C04B 2235/428 (2013.01); C04B 2235/48 (2013.01); C04B 2235/5427 (2013.01); C04B 2235/5436 (2013.01); C10M 2201/061 (2013.01); C10M 2201/10 (2013.01); C10M 2201/102 (2013.01); C10M 2201/103 (2013.01); C10M 2201/105 (2013.01); C10M 2203/10 (2013.01); C10M 2203/102 (2013.01); C10M 2203/104 (2013.01); C10M 2203/108 (2013.01); C10M 2203/1025 (2013.01); C10M 2203/1045 (2013.01); C10M 2207/02 (2013.01); C10M 2207/022 (2013.01); C10M 2207/0203 (2013.01); C10M 2207/0225 (2013.01); C10M 2207/08 (2013.01); C10M 2207/085 (2013.01); C10M 2207/28 (2013.01); C10M 2207/2805 (2013.01); C10M 2207/40 (2013.01); C10M 2207/401 (2013.01); C10M 2217/028 (2013.01); C10N 2210/03 (2013.01); C10N 2210/04 (2013.01); C10N 2210/08 (2013.01); C10N 2220/022 (2013.01); C10N 2230/02 (2013.01); C10N 2240/58 (2013.01);
Abstract
A refractory formulation containing an anhydrous solvent, an oleophilic rheology modifier and a refractory aggregate exhibits non-thermoplastic behavior, and remains plastic and formable at temperatures in the range of 10 degrees Celsius to 180 degrees Celsius. The oleophilic rheology modifier may effectively bind with the solvent to create a gel-like structure with organic solvents with moderate to high polarity. A phyllosilicate clay that has been treated with a quaternary fatty acid amine may be used as the oleophilic rheology modifier.