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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10464807 B1

PDFFull Text
Date of Patent:
Nov. 05, 2019

Filed:

Nov. 15, 2017

Semiconductor device, microphone and method for producing a semiconductor device

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Stefan Barzen, Munich, DE;

Wolfgang Friza, Villach, AT;

Marc Fueldner, Neubiberg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Shumaker & Sieffert, P.A.

Primary Examiner:

Oyesola C Ojo

Int. Cl.
CPC ...
B81B 3/00 (2006.01); H04R 9/08 (2006.01); H04R 31/00 (2006.01); B81C 1/00 (2006.01); H04R 17/02 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/007 (2013.01); B81C 1/00619 (2013.01); H04R 9/08 (2013.01); H04R 31/00 (2013.01); H04R 31/003 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/0361 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0109 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0133 (2013.01); H04R 17/02 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01);
Abstract

A semiconductor device is proposed. The semiconductor device comprises a membrane structure having an opening. Furthermore, the semiconductor device comprises a first backplate structure, which is arranged on a first side of the membrane structure, and a second backplate structure, which is arranged on a second side of the membrane structure. The semiconductor device furthermore comprises a vertical connection structure, which connects the first backplate structure to the second backplate structure. In this case, the vertical connection structure extends through the opening.

Find Patent Forward Citations

Barzen, Stefan. (2019). Semiconductor device, microphone and method for producing a semiconductor device (U.S. Patent No. 10464807). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10464807

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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