The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Apr. 15, 2016
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Eric MacDonald, El Paso, TX (US);

Ryan Wicker, El Paso, TX (US);

David Espalin, El Paso, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B29C 70/68 (2006.01); B29C 70/70 (2006.01); B29C 64/106 (2017.01); B29K 105/20 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
B33Y 80/00 (2014.12); B29C 64/106 (2017.08); B29C 70/688 (2013.01); B29C 70/70 (2013.01); B33Y 10/00 (2014.12); B29K 2105/20 (2013.01); B29K 2105/206 (2013.01); B29K 2705/00 (2013.01); Y10T 428/1352 (2015.01); Y10T 428/1355 (2015.01);
Abstract

A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.


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