The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Jun. 27, 2017
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Hajime Momoi, Tokyo, JP;
Satoru Morioka, Tokyo, JP;
Toshiyuki Ono, Ibaraki, JP;
Hideta Arai, Ibaraki, JP;
Ryo Fukuchi, Ibaraki, JP;
Atsushi Miki, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 15/01 (2006.01); B32B 37/02 (2006.01); C25D 7/06 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 3/26 (2006.01); B32B 38/10 (2006.01); H01M 4/66 (2006.01); H01R 13/03 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); B32B 15/04 (2006.01); C22C 9/06 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 9/08 (2006.01);
U.S. Cl.
CPC ...
B32B 15/20 (2013.01); B32B 3/263 (2013.01); B32B 7/12 (2013.01); B32B 15/01 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/304 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 37/02 (2013.01); B32B 38/10 (2013.01); C25D 7/06 (2013.01); C25D 7/0614 (2013.01); H01L 23/3735 (2013.01); H01M 4/662 (2013.01); H01R 13/03 (2013.01); H05K 1/0204 (2013.01); H05K 1/09 (2013.01); H05K 3/025 (2013.01); H05K 3/108 (2013.01); B32B 15/043 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B32B 2307/538 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); C22C 9/06 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 9/08 (2013.01); H01L 23/3736 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01);
Abstract
A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.