The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Oct. 06, 2016
Applicant:
Japan Polypropylene Corporation, Chiyoda-ku, JP;
Inventors:
Kazuo Asuka, Mie, JP;
Hayato Kitaura, Mie, JP;
Morikazu Niibe, Mie, JP;
Kuninori Takahashi, Mie, JP;
Assignee:
Japan Polypropylene Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/08 (2006.01); B29C 51/02 (2006.01); B29C 48/00 (2019.01); B29C 48/17 (2019.01); B29C 48/21 (2019.01); B29C 51/00 (2006.01); C08J 5/18 (2006.01); C08K 3/34 (2006.01); C08K 7/02 (2006.01); C08K 7/06 (2006.01); C08K 7/14 (2006.01); C08L 23/10 (2006.01); C08L 23/12 (2006.01); B29C 51/10 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 51/02 (2013.01); B29C 48/0011 (2019.02); B29C 48/0012 (2019.02); B29C 48/0017 (2019.02); B29C 48/17 (2019.02); B29C 48/21 (2019.02); B29C 51/00 (2013.01); B29C 51/105 (2013.01); C08J 5/18 (2013.01); C08K 3/34 (2013.01); C08K 7/02 (2013.01); C08K 7/06 (2013.01); C08K 7/14 (2013.01); C08L 23/08 (2013.01); C08L 23/10 (2013.01); C08L 23/12 (2013.01); B29C 2791/006 (2013.01); B29K 2023/08 (2013.01); B29K 2023/14 (2013.01);
Abstract
The present invention provides a thermal molding sheet having a thickness of 1 mm or more and formed by a polypropylene resin composition comprising: 5 to 97 wt % of a polypropylene resin (A) whose MFR and melt tension satisfy specific conditions and which has a long-chain branch structure; 1 to 93 wt % of a polypropylene resin (B) whose MFR satisfies specific conditions; 1 to 40 wt % of a thermoplastic elastomer (C); and 1 to 40 wt % of a filler (D).